TVPX210

3U VPX Carrier with 3 QMC Sites, PCIe Gen3 x2, Rear-I/O, SOSA® aligned

  • SOSA™ algined 3U VPX module
  • Conduction-cooled VPX REDI implementation according to ANSI/VITA 48.2
  • Slot Profile SLT3-PAY-2U2U-14.2.17
  • 3 single-width QMC Sites, compatible with double- and triple-width QMCs
  • Full QMC I/O on VPX P1 and P2 rear I/O
  • PCIe Gen3 x2 from host to QMCs
  • VITA 46.11 compliant Management Controller for surveillance of QMC health status

Product status: In Development

Operating Temperature Range -40 °C to +85 °C RoHS complaint

The TVPX210 is a 3U OpenVPX® carrier board designed in alignment with the SOSA® Technical Standard, enabling system designers to rapidly integrate high-performance modular I/O into next-generation defense and aerospace platforms.

Featuring three VITA 93 QMC sites, the TVPX210 allows system architects to configure application-specific I/O subsystems using a wide range of COTS QMC modules while maintaining a common carrier architecture. This modular approach reduces development effort, simplifies future technology upgrades and supports long platform lifecycles required by modern defense programs. It can be populated with up to 3 single-width QMC modules, a double-width QMC module and a single-width QMC module, or a triple-width QMC module.

The carrier implements the SLT3-PAY-2U2U-14.2.17 payload slot profile and provides a non-blocking PCI Express® Gen3 switch for deterministic high-speed communication between the VPX backplane and installed QMC modules.

The full QMC I/O, which consists of all 5 IOPIPES of all three QMC modules, is accessible on the VPX backplane via the P1 and P2 connectors. The ground of all I/O pipes is connected to VPX system ground, so the TVPX210 is essentially a non-isolated carrier.

The TVPX210 is offered as conduction-cooled carrier with VPX REDI implementation according to ANSI/VITA 48.2.

A VITA 46.11 compliant Management Controller enables health monitoring, inventory management and communication with the VPX System Manager for simplified system integration and maintenance.

Form Factor 3U VPX, compliant with ANSI/VITA 46.0
Mechanical Interface Conduction-cooled VPX REDI implementation according to ANSI/VITA 48.2
OpenVPX Profile ANSI/VITA 65.0 / 65.1, Slot Profile SLT3-PAY-2U2U-14.2.17
System Architecture Designed for alignment with the SOSA® Technical Standard
VPX Module Profile MOD3-PAY-2U2U-16.2.16-2

PCI Express (Base Specification 3.1) compliant Gen3 x2 host interface on Expansion Plane

Number of QMC Sites 3 single-width
Supported QMCs 3x single-width
1x double-width, 1x single-width
1x triple-width
QMC Interface PCIe Gen3 x4
QMC I/O Isolation None
QMC I/O Connection Complete I/O of all QMC sites on VPX rear I/O
I/O Connectors VPX P1 and P2 (Rear I/O)
Management Controller Compliant to IPMI 2.0
Compliant to VITA 46.11-2022, Tier 3
SOSA® v2.0 aligned
Temperature Range Operating: -40 °C to +85 °C
Storage: -40 °C to +85 °C
Humidity 5% – 95% non-condensing

PRODUCT VARIATIONS

TVPX210-10R

3U VPX Carrier with 3 QMC Sites, PCIe Gen3 x2, Rear-I/O, SOSA® aligned

Conduction-cooled VPX REDI implementation according to ANSI/VITA 48.2

Data Sheet

Data Sheet

Data Sheet - Issue 1.0.0