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  • TPCE260 I PCI Express PMC Carrier

    TPCE260

    PCI Express PMC Carrier
    • Standard height PCI Express Revision 1.1 compatible module
    • Cost effective solution to provide I/O in PCIexpress environment
    • Flexible I/O (TEWS offers a wide range of I/O PMCs)
    • PCIexpress x1 link
    • Supports one single-width 32 bit PMC
    • 33 MHz / 66 MHz PCI frequency (PMC site)
    • Provides access to the PMC front
    • Provides rear I/O (P14) through a VME P2 style connector
    VIEW FULL SPECIFICATIONS
  • TPCE261 I PCI Express x1 PMC Carrier

    TPCE261

    PCI Express x1 PMC Carrier

    $1.00
    • Standard height PCI Express Revision 2.0 compatible module
    • Cost effective solution to provide I/O in PCIexpress environment
    • Flexible I/O (TEWS offers a wide range of I/O PMCs)
    • PCIexpress x1 link with 2.5 GT/s
    • Supports one single-width 32 bit PMC
    • 33 MHz / 66 MHz PCI frequency (PMC site)
    • Provides access to the PMC front panel I/O
    • Provides rear I/O (P14) through a 68 pin ERNI SMC 1.27 mm flat cable connector
    VIEW FULL SPECIFICATIONS
  • TPCE275 I PCI Express x1, Gen 1 XMC Carrier

    TPCE275

    PCI Express x1, Gen 1 XMC Carrier
    • Standard height PCI Express Revision 1.1 compatible module
    • Cost effective solution to provide I/O in PCI Express environment
    • Flexible I/O (TEWS offers a wide range of I/O XMCs)
    • Supports 1 single-width XMC
    • Provides front panel I/O
    • Provides XMC P14 rear I/O through VME P2 connector
    • Provides XMC P16 rear I/O through two 50-pin flat cable connectors
    • PCI Express x1 from host board to XMC
    • PCIe Redriver allows safe operation of XMC module in distributed PCIe systems
    VIEW FULL SPECIFICATIONS
  • TPCE277 I PCI Express x1, Gen3 XMC Carrier

    TPCE277

    PCI Express x1, Gen3 XMC Carrier
    • Standard height PCI Express Revision 3.0 compatible module
    • Cost effective solution to provide I/O in PCI Express environment
    • Flexible I/O (TEWS offers a wide range of I/O XMCs)
    • Supports 1 single-width XMC
    • Provides front panel I/O
    • PCI Express x1 from host board to XMC
    • PCIe Gen3 Redriver allows safe operation of XMC module in distributed PCIe systems
    VIEW FULL SPECIFICATIONS
  • TPCE278 I PCI Express x4, Gen3 XMC Carrier

    TPCE278

    PCI Express x4, Gen3 XMC Carrier
    • Standard height PCI Express Revision 3.0 compatible module
    • Cost effective solution to provide I/O in PCI Express environment
    • Flexible I/O (TEWS offers a wide range of I/O XMCs)
    • Supports 1 single-width XMC
    • Provides front panel I/O
    • Provides XMC P14 rear I/O through Tyco AMPMODU System 50 0.050x0.100 flat ribbon cable connector
    • Provides XMC P16 rear I/O through two Samtec QTH-DP 0.50mm Q Pairs High Speed Ground Plane Socket Strip, Differential Pair connector
    • PCI Express x4 from host board to XMC
    • PCIe Gen3 Redriver allows safe operation of XMC module in distributed PCIe systems
    VIEW FULL SPECIFICATIONS
  • TPCE280 I PCI Express x8, Gen3 XMC Carrier

    TPCE280

    PCI Express x8, Gen3 XMC Carrier
    • Standard height, half length PCI Express Revision 3.0 compatible module
    • Cost effective solution to provide I/O in PCI Express environment
    • Flexible I/O (TEWS offers a wide range of I/O XMCs)
    • Supports 1 single-width XMC
    • Provides front panel I/O
    • Provides XMC P14 rear I/O through 68-pin ERNI SMC, right angle male, 1.27mm pitch connector
    • Provides XMC P16 rear I/O through two Samtec Firefly UCC8 and UEC5 connectors
    • PCI Express x8 from host board to XMC
    • PCIe Gen3 Redriver allows safe operation of XMC module in distributed PCIe systems
    • Provides a fan mounted under the XMC slot that helps cooling the system
    VIEW FULL SPECIFICATIONS

  • TPCE636

    Reconfigurable FPGA with 16x Analog Input and 16x Analog Output
    • Standard height, half-length PCI Express 2.1 compliant module
    • Supports PCI Express x4 link
    • User configurable FPGA (AMD Kintex™ 7)
    • 1 Gbyte, 32 bit wide DDR3 SDRAM
    • 64 FPGA I/O lines on back I/O connector
      • 64 single ended LVCMOS25 or 32 differential LVDS25 interface.
    • 16 channels 16 bit ADC
      • Differential interface
      • Input range ±20 V
      • Sampling rate up to 5 Msps
    • 16 channels 16 bit DAC
      • Output range ±10 V
    • Front panel I/O via Samtec ERF8-049 Rugged EdgeRate connector
    VIEW FULL SPECIFICATIONS
  • TPCE863 I High Speed Synch/Asynch Serial Interface

    TPCE863

    4 Channel High Speed Synch/Asynch Serial Interface
    • Standard height, half-length PCI Express 1.1 compliant module
    • 4 high speed serial data communication channels
    • A wide range of I/O interfaces individually programmable for each channel
    • Several communication protocols
      • asynchronous (with oversampling)
      • isochronous
      • HDLC
    • 512 longword FIFO (512 x 32 bit) per channel
    • DMA support
    • Different signal encodings (NRZ, NRZI, FM0, FM1 and Manchester)
    • Multiple clock sources (for a wide bitrate spectrum)
    • Front panel I/O via HD68 SCSI-3 type connector
    VIEW FULL SPECIFICATIONS

  • TPCE001-TM

    VG64 I/O Transition Module
    • Transition module for TEWS PCI and PCI Express carrier
    • Connects VG64 I/O connector and 68 pin AMPMODU flat cable connector
    VIEW FULL SPECIFICATIONS