TEWS Technologies today announced the TPCE646, a user-reconfigurable mixed-signal board featuring an AMD Zynq™ UltraScale+™ MPSoC in a standard PCI Express® x8 form factor.
Learn moreTEWS Technologies GmbH today announced the TVNX210, a VNX+ Carrier Board for QMC modules. The product launch coincides with the official ratification of the VITA 90 VNX+ standard, marking a significant milestone for the rugged embedded computing industry.
Learn moreTEWS Technologies GmbH today announced a major expansion of its embedded VITA 93-QMC product portfolio, introducing eight new single-width QMC modules and the industry's first CompactPCI Serial QMC carrier.
Learn moreWe are proud to announce that Uwe Tews, founder of TEWS Technologies GmbH, has been inducted into the VITA Technologies Hall of Fame.
Learn moreTEWS Technologies has formed a strategic system integrator agreement with Elma Electronic US, a premier provider of open standards-based system integration and embedded platform solutions.
Learn moreTEWS Technologies is pleased to announce that the VITA Standard Organization and ANSI have formally ratified ANSI/VITA 93.0-2025 QMC, marking a key milestone in the evolution of modular I/O and mezzanine architecture for embedded systems. As an active member of the VITA 93 – QMC working group, TEWS is committed to delivering products and solutions […]
Learn moreThe Military Embedded Systems magazine shared our industry perspective on the emerging VITA 93 – QMC Standard. Learn more about our thoughts on how VITA 93 will be a strategic leap forward and what sets it apart. The article will also bring perspective on VITA 93’s position within a VPX-centric world and its integration within […]
Learn moreTEWS Technologies, an industry leader in embedded I/O solutions, is proud to announce the launch of the TXMC391, a high-performance, conduction-cooled XMC module featuring four 1000BASE-KX Ethernet interfaces.
Learn moreStrengthening Innovation and Collaboration in Adaptive Computing TEWS Technologies, a global leader in embedded I/O solutions, is proud to announce that it has joined the Premier Tier of the AMD Embedded Partner Program. This recognition places TEWS among an elite group of strategic partners acknowledged for their outstanding technical expertise and long-standing commitment to AMD’s […]
Learn moreTEWS Technologies, a global leader in embedded I/O solutions for demanding industrial and defense applications, is pleased to announce the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard. The new VITA 93 – QMC standard solves many problems […]
Learn moreEarlier this year TEWS Technologies proudly introduced the new VITA 93 – QMC mezzanine card standard at the Embedded Tech Trends (ETT) forum in San Antonio, Texas. Our General Managers Jan Zimmermann and Tim Tews joined industry leaders to present the new standard to a global audience of media and industry experts. A Collaborative Launch […]
Learn moreTEWS Technologies is excited to announce our participation in an upcoming webinar titled “Understanding the Future of Small Form Factor I/O: Deep Dive into the QMC – VITA 93 Standard.” This event is scheduled for March 5, 2025, at 11:00 AM ET (4:00 PM GMT) and will provide valuable insights into the revolutionary VITA 93 […]
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