TEWS Technologies Unveils Industry’s Most Comprehensive VITA 93 – QMC Portfolio, Accelerating Adoption of the New Mezzanine Standard
TEWS Technologies GmbH today announced a major expansion of its embedded VITA 93 – QMC product portfolio, introducing eight new single-width QMC modules and the industry’s first QMC Carrier for CompactPCI-Serial systems. These additions offer customers greater flexibility, simplified integration, and improved scalability for demanding embedded computing applications. With this announcement, TEWS Technologies reinforces its position as a technology leader and early adopter of the VITA 93 – QMC standard, offering the industry’s most comprehensive QMC portfolio to date.
VITA 93 – QMC marks a fundamental shift in mezzanine design. It addresses the need for compact, scalable, and high-performance I/O under strict SWaP constraints. This is especially important in the aerospace and defense sectors. By providing a broad QMC ecosystem early in the standard’s lifecycle, TEWS empowers system designers to integrate QMC with confidence in next-generation embedded platforms.
“VITA 93 is more than a new form factor. It’s a new way of thinking about modular architectures,” said Tim Tews, General Manager of TEWS Technologies. “By bringing the most comprehensive QMC portfolio to market early, we drive adoption of the standard. We give customers a clear, low-risk migration path to future-proof embedded systems.”
Eight New QMC Modules Covering Key I/O Functions
The newly announced QMC modules conform to the VITA 93.0 specification and span a wide range of commonly required I/O functions, enabling flexible system configuration using a consistent small-form-factor mezzanine architecture:
All modules are designed for industrial temperature operation and are available in air cooled and conduction cooled variants, reflecting the inherent mechanical flexibility of the QMC standard. As with all TEWS products, the modules are backed by a five-year standard warranty and long-term lifecycle support.
“The strength of QMC lies in its modularity and scalability,” said Jan Zimmermann, General Manager of TEWS Technologies. “Our QMC modules allow system architects to mix and match high-performance I/O functions on a single carrier, while benefiting from PCIe connectivity, robust isolation concepts, and a unified mechanical design for air- and conduction cooled systems.”
TCPS210: The First QMC Carrier for CompactPCI-Serial Systems
Complementing the QMC module portfolio, TEWS Technologies also introduced the TCPS210, the first CompactPCI-Serial carrier with QMC sites. The 3U carrier supports three QMC sites and integrates a non-blocking PCIe switch to distribute host bandwidth efficiently across installed modules.
The QMC Carrier is designed to support integration into conduction cooled systems. For enhanced system monitoring, an IPMC controller is mounted on the TCPS210, enabling real-time QMC health status tracking and seamless communication.
The TCPS210 enables system designers to build highly modular, space-efficient I/O subsystems within CompactPCI-Serial platforms while taking full advantage of the QMC standard. This marks an important milestone in extending the VITA 93 ecosystem.
Driving VITA 93 Adoption Across the Embedded Ecosystem
An active member of the VITA Standards Organization for many decades, TEWS Technologies has played a key role in the evolution of mezzanine standards and is now applying that experience to VITA 93 – QMC.
Looking ahead, TEWS plans to further expand its QMC ecosystem with additional carrier solutions for VPX and VNX+, as well as new QMC modules addressing high-performance processing and specialized interfaces. This roadmap underlines TEWS’ long-term commitment to VITA 93 as a cornerstone technology for future embedded systems.