The TCPS210 is a PICMG CPCI-S.0 R3.0 compatible 3U module providing 3 single-width QMC sites, used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control.

It can be populated with up to 3 single-width QMC modules, a double-width QMC module and a single-width QMC module, or a triple-width QMC module.

The PCI Express x4 link from the host board (CompactPCI-Serial CPU) is distributed to the 3 QMC sites as x4 links by a non-blocking PCI-Express switch.

QMC I/O is accessible via the CompactPCI-Serial Rear-I/O connectors P2, P3 and P4.

For enhanced system monitoring, an IPMC controller is mounted on the TCPS210, enabling real-time QMC health status tracking and seamless communication. For integration in your specific system configuration, please contact TEWS.

The TCPS210 CompactPCI-Serial QMC Carrier is designed to support integration into conduction cooled systems. Please contact TEWS to discuss your specific system requirements.

Mechanical Interface	CompactPCI-Serial 3U Board conforming to PICMG CPCI-S.0 R3.0
Electrical Interface	PCIe Revision 3.1 Gen3 x4
Number of QMC Sites	3 single-width
Supported QMCs	3x single-width 1x double-width, 1x single-width 1x triple-width
QMC Interface	PCIe Gen3 x4
QMC I/O Isolation	Yes
QMC I/O Connection	Complete I/O of all QMC sites on CPCI-S.0 Rear I/O
I/O Connectors	P2, P3 and P4 (Rear I/O)
Temperature Range	Operating: -40 °C to +85 °C Storage: -40 °C to +85 °C
MTBF	321 000 h
Humidity	5% – 95% non-condensing

PRODUCT VARIATIONS

TCPS210-10R

CompactPCI-Serial Carrier with 3 QMC Sites, PCIe Gen3 x4, Rear-I/O

3 single-width QMC Sites, double- and triple-width compatible; Full QMC I/O on rear I/O; PCIe Gen3 x4

Data Sheet

Issue 1.0.1