3U CompactPCI Serial XMC Module Carrier

  • PICMG CPCI-S.0 R2.0 compatible 3U module
  • cost effective solution to provide I/O in CompactPCI Serial environment
  • flexible I/O (TEWS offers a wide range of I/O XMCs)
  • supports one single-width XMC
  • provides front panel I/O
  • 33 MHz and 66 MHz PCI frequency
  • PCI Express X4 from host board to XMC
  • PCIe Gen3 Redriver allows safe operation of XMC module in distributed PCIe systems

Product status: Active

The TCPS275 is a PICMG CPCI-S.0 R2.0 compatible 3U module that provides one slot for a single-width XMC module used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control.

The TCPS275 is a versatile solution to upgrade well known XMC I/O solutions to the CompactPCI Serial standard.

The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules in distributed PCIe systems.

The TCPS275 supports XMC front panel I/O.

VPWR is 12 V for all variants.

compactPCI Serial Compact Serial 3U Front Board conforming to PICMG CPCI-S.0 R2.0

PCIe: x4 link, USB: not supported, SATA: not supported, I²C, WAKE, GA[0:2]: Connected to XMC slot

XMC Slot Single-Width XMC Mezzanine Card conforming to ANSI/VITA 42.0-2008 (R2014), ANSI/VITA 42.3-2006 (R2014)

PCIe x4 link, connected through PCIe Gen 3 redriver

Number of XMC Slots 1
XMC I/O Access XMC Front Panel I/O
I/O Power Supply Access 3.3 V: 3 A

VPWR: Connected to the backplane 12 V

PCI Express ReDriver DS80PCI402 (Texas Instruments)
Power Requirements 25 mA typical @ +12 V DC (without XMC)
Additional power is required by the XMC Module!
Temperature Range Operating -40°C to +85°C, Storage -40°C to +85°C
MTBF 1026000 h
Humidity 5-95 % non-condensing
Weight 115 g



1 Slot Standard-XMC Carrier, PCIe x4, VPWR = 12V

Data Sheet

Data Sheet - Issue 1.0.0

User Manual

User Manual - Issue 1.0.0