TEWS Technologies Joins Premier Tier in the AMD Embedded Partner Program
Strengthening Innovation and Collaboration in Adaptive Computing
TEWS Technologies, a global leader in embedded I/O solutions, is proud to announce that it has joined the Premier Tier of the AMD Embedded Partner Program. This recognition places TEWS among an elite group of strategic partners acknowledged for their outstanding technical expertise and long-standing commitment to AMD’s product portfolio. The Premier Tier status brings with it enhanced access to AMD technical resources, development tools, and strategic support, which will significantly bolster TEWS’ adaptive computing capabilities and product offerings.
The AMD Embedded Partner Program supports innovation across industries by connecting AMD with trusted partners that specialize in delivering solutions based on AMD adaptive SoCs, FPGAs, and embedded platforms. Being elevated to the Premier Tier reflects TEWS Technologies’ proven capabilities in developing high-performance, reliable hardware aligned with the latest AMD embedded roadmap. It also signifies TEWS’ role as a valued collaborator capable of supporting global customers with sophisticated, tailor-made, AMD-based solutions.
“Our partnership with TEWS Technologies exemplifies the value that AMD Embedded Partners bring to the table,” said Kirk Saban, corporate vice president, AECG Product, Software and Solutions, AMD. “With their expertise in creating specialized embedded I/O solutions, TEWS Technologies enables seamless integration and customization of AMD embedded products, driving maximum impact and value for mutual customers. By leveraging the latest AMD embedded technologies, they help customers innovate with confidence and bring cutting-edge products to market faster.”
TEWS Technologies offers a comprehensive portfolio of user-reconfigurable FPGA solutions based on AMD devices, supporting a wide range of industry-standard form factors, including PMC, XMC, PCIe, mPCIe, and QMC. These flexible modules are designed to meet the demanding requirements of industrial, defense, medical, and scientific applications, providing customers with the ability to implement custom logic and high-speed data processing on proven, ruggedized hardware platforms. By leveraging AMD’s powerful portfolio, TEWS delivers adaptable I/O and signal processing capabilities that can be tailored to virtually any use case.
“Joining the AMD Premier Tier is a proud milestone for TEWS Technologies,” said Tim Tews, General Manager. “It reflects our decades-long dedication to embedded design excellence and opens new avenues to co-innovate with AMD. Together, we will accelerate the delivery of cutting-edge, scalable solutions that our global customers can rely on for the most demanding applications.”
As a Premier Tier partner, TEWS gains enhanced access to technical resources, development tools, and strategic support from AMD. For TEWS customers, this means an even faster time-to-market, better integration of the latest AMD technologies, and access to cutting-edge solutions developed in close collaboration with AMD. The partnership enables TEWS to deliver greater value through early access to product roadmaps, deeper technical insight, and prioritized engineering support, ensuring the highest level of service and innovation in every solution delivered.
