VITA 93 – QMC
THE NEXT GeNERATION Flexible Mezzanine Concept
The new VITA 93 – QMC standard addresses the inherent challenges in current mezzanine card standards through its innovative QMC architecture, enabling unprecedented modularity, flexibility, and scalability while maintaining backward compatibility and rugged reliability. VITA 93 – QMC builds on lessons learned from previous standards, blending their best features with new capabilities for the future.
MORE THAN 40 YEARS OF EXPERIENCE
Customer first approach
Using this customer first approach, TEWS has developed a large number of standard and custom products for applications in industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS. TEWS line of embedded I/O solutions is available worldwide through a global network of distributors.
Latest News
TEWS Technologies Joins Premier Tier in the AMD Embedded Partner Program
Strengthening Innovation and Collaboration in Adaptive Computing TEWS Technologies, a global leader in embedded I/O solutions, is proud to announce that it has joined the Premier Tier of the AMD Embedded Partner Program. This recognition places TEWS among an elite group of strategic partners acknowledged for their outstanding technical expertise and long-standing commitment to AMD’s […]
TEWS Technologies introduces first QMC Modules and PCIe Carrier Compliant with new VITA 93 – QMC Standard
TEWS Technologies, a global leader in embedded I/O solutions for demanding industrial and defense applications, is pleased to announce the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard. The new VITA 93 – QMC standard solves many problems […]
Introduction of VITA 93 – QMC at Embedded Tech Trends: Video available
Earlier this year TEWS Technologies proudly introduced the new VITA 93 – QMC mezzanine card standard at the Embedded Tech Trends (ETT) forum in San Antonio, Texas. Our General Managers Jan Zimmermann and Tim Tews joined industry leaders to present the new standard to a global audience of media and industry experts. A Collaborative Launch […]
Join Our Upcoming Webinar: Exploring the new VITA 93 – QMC Standard
TEWS Technologies is excited to announce our participation in an upcoming webinar titled “Understanding the Future of Small Form Factor I/O: Deep Dive into the QMC – VITA 93 Standard.” This event is scheduled for March 5, 2025, at 11:00 AM ET (4:00 PM GMT) and will provide valuable insights into the revolutionary VITA 93 […]
White Paper Detailing Revolutionary VITA 93 – QMC Standard’s Modularity, Flexibility, Scalability, and Thermal Advantages Released by TEWS Technologies
New white paper explores how VITA 93 – QMC technology addresses critical SWaP challenges in embedded computing The VITA 93 – QMC standard is transforming embedded computing design in defense, industrial, and transportation applications. A new white paper authored by experts at TEWS Technologies provides system architects and design engineers with crucial insights into how […]
TEWS Technologies Partners with HAWKS Racing Formula Student Team
We are thrilled to announce that TEWS Technologies is now an official sponsor of the HAWKS Formula Student team from the University of Applied Sciences Hamburg (HAW Hamburg). This collaboration underscores our commitment to fostering innovation, supporting young engineering talent, and advancing cutting-edge technology.