News

TEWS Technologies Joins Premier Tier in the AMD Embedded Partner Program

Strengthening Innovation and Collaboration in Adaptive Computing TEWS Technologies, a global leader in embedded I/O solutions, is proud to announce that it has joined the Premier Tier of the AMD Embedded Partner Program. This recognition places TEWS among an elite group of strategic partners acknowledged for their outstanding technical expertise and long-standing commitment to AMD’s […]

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TEWS Technologies introduces first QMC Modules and PCIe Carrier Compliant with new VITA 93 – QMC Standard

TEWS Technologies, a global leader in embedded I/O solutions for demanding industrial and defense applications, is pleased to announce the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard. The new VITA 93 – QMC standard solves many problems […]

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Introduction of VITA 93 – QMC at Embedded Tech Trends: Video available

Earlier this year TEWS Technologies proudly introduced the new VITA 93 – QMC mezzanine card standard at the Embedded Tech Trends (ETT) forum in San Antonio, Texas. Our General Managers Jan Zimmermann and Tim Tews joined industry leaders to present the new standard to a global audience of media and industry experts. A Collaborative Launch […]

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Join Our Upcoming Webinar: Exploring the new VITA 93 – QMC Standard

TEWS Technologies is excited to announce our participation in an upcoming webinar titled “Understanding the Future of Small Form Factor I/O: Deep Dive into the QMC – VITA 93 Standard.” This event is scheduled for March 5, 2025, at 11:00 AM ET (4:00 PM GMT) and will provide valuable insights into the revolutionary VITA 93 […]

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White Paper Detailing Revolutionary VITA 93 – QMC Standard’s Modularity, Flexibility, Scalability, and Thermal Advantages Released by TEWS Technologies

New white paper explores how VITA 93 – QMC technology addresses critical SWaP challenges in embedded computing The VITA 93 – QMC standard is transforming embedded computing design in defense, industrial, and transportation applications. A new white paper authored by experts at TEWS Technologies provides system architects and design engineers with crucial insights into how […]

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TEWS Technologies Partners with HAWKS Racing Formula Student Team

We are thrilled to announce that TEWS Technologies is now an official sponsor of the HAWKS Formula Student team from the University of Applied Sciences Hamburg (HAW Hamburg). This collaboration underscores our commitment to fostering innovation, supporting young engineering talent, and advancing cutting-edge technology.

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TEWS Technologies Introduces TPMC151: Advanced 4-Channel Resolver/LVDT/RVDT-to-Digital Converter PMC Module

TPMC151 adds cost-effective Resolver or LVDT/RVDT-to-Digital PMC based on an FPGA design for flexibility, high-reliability, and long-life cycle for advanced and high-demanding motion control applications. Key Features of the TPMC151 TEWS Technologies, a leading provider of embedded I/O solutions, is proud to announce the launch of the TPMC151, a versatile 4-channel Resolver or LVDT/RVDT-to-Digital Converter […]

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Location Campaign for the District of Pinneberg

We have been invited to participate in the district of Pinneberg’s new location campaign by Kreis Pinneberg Wirtschaft. The campaign aims to showcase the region’s full potential and provides some insights into several local businesses. We are participating as campaign ambassadors and are proud to call the district of Pinneberg our home for our entire […]

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Conduction Cooled XMC Card for Enhanced Ethernet Connectivity in Demanding Applications

TEWS Technologies, renowned for its expertise in designing and building turnkey, embedded interface solutions, launched its latest product, the COTS TXMC397 Conduction Cooled Switched Mezzanine Card (CCXMC)-compatible module. The TXMC397 is an innovative addition to the company’s portfolio, offering high-speed Ethernet connectivity for a variety of demanding applications.

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TEWS Technologies Adds Higher Performance Advanced FPGA to Enhance Existing Range of Digital and Analog XMC Modules

TEWS Technologies, a leader in designing and building turn-key, embedded interface solutions, adds more performance and flexibility with its latest innovative FPGA solution on XMC modules, the TXMC639. A standard single-width Switched Mezzanine Card (XMC) compatible module, it adds higher performance and flexibility to the current XMC line for digital and analog applications.

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TEWS Technologies moves into new company headquarters

After laying the foundation stone in January last year, electronics company TEWS Technologies has moved into its new premises in Parkstadt Eggerstedt. After just under a year of construction, the modern two-story building with an area of 1,700 square meters was completed at the end of last year.

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