August 16, 2023

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

TEWS Technologies, a leader in designing and building turn-key, embedded interface solutions, unveiled its latest innovative FPGA solution, the TXMC637. A standard single-width Switched Mezzanine Card (XMC) compatible module, it introduces unparalleled adaptability for digital and analog applications. This groundbreaking module will transform complex industrial processes, ensuring a high level of precision, speed, and adaptability in managing them.

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April 3, 2023

TEWS Technologies Introduces High-Density Simulation PMC with 8 Analog Current Inputs, 16/8 Analog High-Voltage Inputs, 8 Analog Voltage/Current Outputs and 8 Digital LVTTL/TTL I/O

TEWS Technologies adds to its high-density embedded I/O product line with the introduction of the TPMC543, a standard 32-bit 33MHz single-wide PCI Mezzanine Card (PMC) module optimized for simulation applications and industrial control, traffic control and COTS requirements. The TPMC543 offers high density channels with current inputs, current outputs, high-voltage inputs, and standard voltage outputs […]

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February 16, 2023

TEWS Technologies Extends mPCIe Module Family Into Communications with FPGA-Based 3 Channel High Speed Synch/Asynch Serial Interface

TEWS extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous standard full PCI Express Mini Card module with three high speed serial data communication channels. The TMPE863 is designed for data communications, LAN/WAN networking, traffic control, simulation, telecommunications, and COTS applications.

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January 27, 2023

TEWS Technologies Introduces Extended Temperature High-Density Digital I/O Conduction Cooled PMC Module

TEWS adds to its already broad offering of conduction cooled PMCs with the release of the high-density 64 Digital TTL I/O or 32 Differential I/O TPMC321 module.

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